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Patent Searching and Data


Title:
CONDUCTIVE MATERIAL FOR CONNECTION COMPONENT
Document Type and Number:
WIPO Patent Application WO/2017/110859
Kind Code:
A1
Abstract:
This conductive material for a connection component is obtained by forming, on a surface of a base metal formed from a plate strip made from a copper alloy or copper, a Cu-Sn alloy coating layer 5 having a Cu content of 55-70 at.% and an average thickness of 0.1-3.0 μm, and an Sn coating layer 6 having an average thickness of 0.2-5.0 μm, in this order. When the surface of the material is observed as a backscattered electron image at a magnification of 100-times by a scanning electron microscope, region A coexists, on the surface of the material, with region B which has a brightness higher than that of region A and from which the Cu-Sn alloy coating layer is not exposed, and the area percentage of region A is 2-65%. Further, when region A is observed at a magnification of 10,000-times by the scanning electron microscope, region C coated with the Sn coating layer coexists with region D not coated with the Sn coating layer, and the area percentage of region C in region A is 20-70%.

Inventors:
TSURU, Masahiro
KATSURA, Shinya
Application Number:
JP2016/088071
Publication Date:
June 29, 2017
Filing Date:
December 21, 2016
Export Citation:
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Assignee:
KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.) (2-4 Wakinohama-Kaigandori 2-chome, Chuo-ku Kobe-sh, Hyogo 85, 〒6518585, JP)
International Classes:
C25D7/00; C25D5/12; C25D5/50; H01R13/03
Foreign References:
JP2013139640A2013-07-18
JP2011042660A2011-03-03
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (AOYAMA & PARTNERS, Umeda Hankyu Bldg. Office Tower 8-1, Kakuda-cho, Kita-ku, Osaka-sh, Osaka 17, 〒5300017, JP)
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