CONDUCTIVE MATERIAL, CONNECTION STRUCTURE BODY, AND CONNECTION STRUCTURE BODY PRODUCTION METHOD

Title:

CONDUCTIVE MATERIAL, CONNECTION STRUCTURE BODY, AND CONNECTION STRUCTURE BODY PRODUCTION METHOD

Document Type and Number:

WIPO Patent Application WO/2018/047690

Kind Code:

A1

Abstract:

Provided is a conductive material that allows solder on conductive particles to be disposed efficiently on an electrode even after the conductive material has been left standing for a set period of time, and is such that the yellowing of the conductive material can be sufficiently suppressed during heating. This conductive material contains a plurality of conductive particles having solder on the outer surface portion of a conductive portion, a curable compound, and a boron trifluoride complex.

More Like This:

JP5707133	Manufacturing method of composite nanoparticles
JP2020115473	CONDUCTIVE PASTE COMPOSITION AND SEMICONDUCTOR DEVICES MADE THEREWITH
JP5764931	A method for producing a photosensitive paste for forming an organic-inorganic composite conductive pattern and an organic-inorganic composite conductive pattern.

Inventors:

SOU SHIKE (JP)
ITOU MASAHIRO (JP)
SADANAGA SHUUJIROU (JP)

Application Number:

PCT/JP2017/031101

Publication Date:

March 15, 2018

Filing Date:

August 30, 2017

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SEKISUI CHEMICAL CO LTD (JP)

International Classes:

H01B1/22; C09J9/02; H01B1/00; H01B1/02; H01B5/16; H01L21/60; H01R11/01

Domestic Patent References:

WO2015050252A1

2015-04-09

Foreign References:

JP2013510220A	2013-03-21
US20130146342A1	2013-06-13