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Patent Searching and Data


Title:
CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2013/021895
Kind Code:
A1
Abstract:
Provided are a conductive material with which it is possible to improve conduction reliability and insulation reliability of a connection structure obtained in a case where electrodes of members to be connected are electrically connected regardless of the use of a cation generator, as well as a connection structure that uses the conductive material. This conductive material contains a curable component, a cation exchanger, an anion exchanger, and conductive particles (5). The curable component comprises a curable compound and a cation generator. This connection structure (1) has a first member to be connected (2), a second member to be connected (4), and a connecting part (3) for electrically connecting the first member to be connected (2) and the second member to be connected (4). The connecting part (3) is formed by curing the conductive material.

Inventors:
YUUKI AKIRA (JP)
SHIMAOKA JUNICHI (JP)
KOBAYASHI HIROSHI (JP)
ISHIZAWA HIDEAKI (JP)
Application Number:
PCT/JP2012/069587
Publication Date:
February 14, 2013
Filing Date:
August 01, 2012
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
YUUKI AKIRA (JP)
SHIMAOKA JUNICHI (JP)
KOBAYASHI HIROSHI (JP)
ISHIZAWA HIDEAKI (JP)
International Classes:
H01B1/20; C08L101/12; C09J9/02; C09J11/00; C09J201/00; H01B5/16; H01L21/60; H01R11/01; H05K1/14
Domestic Patent References:
WO2011062137A12011-05-26
Foreign References:
JPH1160899A1999-03-05
JPH10245528A1998-09-14
JP2001237006A2001-08-31
JP2007016088A2007-01-25
JP2000297204A2000-10-24
JPH0543866A1993-02-23
JP2006274120A2006-10-12
JP2012084518A2012-04-26
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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Claims: