Title:
CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/174065
Kind Code:
A1
Abstract:
Provided is a conductive material with which solder can be efficiently arranged on an electrode, even if the conductive material is left to stand for a fixed period of time, and which is capable of achieving excellent solder wetting properties. A conductive material according to the present invention includes a thermosetting compound, and a plurality of solder particles. The concentration of free tin ions in the conductive material is 100 ppm or lower.
Inventors:
KUBOTA TAKASHI (JP)
NISHIOKA KEIZO (JP)
NISHIOKA KEIZO (JP)
Application Number:
PCT/JP2018/011067
Publication Date:
September 27, 2018
Filing Date:
March 20, 2018
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/22; H01B5/16; H01R11/01
Domestic Patent References:
| WO2014112540A1 | 2014-07-24 |
Foreign References:
| JP2012046756A | 2012-03-08 | |||
| JP2002361484A | 2002-12-18 | |||
| JP2008006499A | 2008-01-17 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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