Title:
CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/054288
Kind Code:
A1
Abstract:
Provided is a conductive material, the storage stability of which can be efficiently increased and which can be densely filled with flux, and which can also efficiently increase solder coalescing properties during conductive connection. This conductive material comprises a plurality of conductive particles having solder on the outer surface portions of conductive parts, a thermosetting component, and flux, wherein the flux contains solid salt of a first compound having a carboxyl group and a second compound having an amino group, and a liquid compound which is a reactant of a third compound having a carboxyl group and a fourth compound having an amino group.
Inventors:
SOU SHIKE (JP)
ITOU MASAHIRO (JP)
SADANAGA SHUUJIROU (JP)
OOHASHI KENJI (JP)
ITOU MASAHIRO (JP)
SADANAGA SHUUJIROU (JP)
OOHASHI KENJI (JP)
Application Number:
PCT/JP2019/031425
Publication Date:
March 19, 2020
Filing Date:
August 08, 2019
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/22; B23K35/363; H01B1/00; H01B5/16; H01R11/01; H05K3/32; B23K35/26; C22C13/00
Foreign References:
| JP2017080797A | 2017-05-18 | |||
| JP2004025305A | 2004-01-29 | |||
| JP2018060709A | 2018-04-12 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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