Title:
CONDUCTIVE MATERIAL, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2024/042914
Kind Code:
A1
Abstract:
This conductive material has, in the following order: a base material composed of copper or a copper alloy; a base layer that is at least one layer made of at least one selected from the group consisting of Ni, Co, and Fe; a Cu-Sn alloy layer; and a Sn layer, wherein a portion of the Cu-Sn alloy layer is exposed on a Sn layer-side surface of the conductive material, and an arithmetic mean height evaluated with a cutoff value of 25 μm is at least 0.03 μm in a 250 μm square region containing at least 50 area% of the Sn layer on the Sn layer-side surface of the conductive material.
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Inventors:
UEDA YUTARO
Application Number:
PCT/JP2023/026081
Publication Date:
February 29, 2024
Filing Date:
July 14, 2023
Export Citation:
Assignee:
KOBE STEEL LTD (JP)
International Classes:
C25D7/00; C25D5/12; C25D5/50; H01B1/02; H01B5/02; H01B13/00; H01R13/03
Foreign References:
| JP2011012320A | 2011-01-20 | |||
| JP2017115210A | 2017-06-29 | |||
| JP2016044358A | 2016-04-04 | |||
| JP2014162944A | 2014-09-08 | |||
| JP2009052076A | 2009-03-12 |
Attorney, Agent or Firm:
YAMAO, Norihito (JP)
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