CONDUCTIVE MEMBER AND MANUFACTURING METHOD THEREOF

Title:

CONDUCTIVE MEMBER AND MANUFACTURING METHOD THEREOF

Document Type and Number:

WIPO Patent Application WO/2010/119489

Kind Code:

A1

Abstract:

The conductive member has a stable contact resistance, resists peeling, displays a low insertion/removal force and is stable when used as a connector, and has an excellent fusing characteristic when used as a fuse. A Cu-Sn intermetallic compound layer (4) is formed between a Ni-based underlayer (3) formed on a Cu-based base material (1), and a Sn-based surface layer (5) that forms the surface. In addition, the Cu-Sn intermetallic compound layer (4) comprises a Cu3Sn layer (6) disposed on the Ni-based underlayer (3) and a Cu6Sn5 layer (7) that is disposed on the Cu3Sn layer (6). The surface roughness of the contact face between the Sn-based surface layer (5) and the Cu-Sn intermetallic compound layer (4) combining the Cu3Sn layer (6) and Cu6Sn5 layer (7) has an arithmetic mean roughness Ra of 0.05-0.25 μm, and the maximum valley depth Rv of the roughness curve is 0.05-1.00 μm. Furthermore, the Cu3Sn layer covers the Ni-based underlayer with a surface coverage of 60-100%.

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Inventors:

SAKURAI TAKESHI (JP)
ISHIKAWA SEIICHI (JP)
KUBOTA KENJI (JP)
TAMAGAWA TAKASHI (JP)

Application Number:

PCT/JP2009/003280

Publication Date:

October 21, 2010

Filing Date:

July 13, 2009

Export Citation:

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Assignee:

MITSUBISHI SHINDO KK (JP)
SAKURAI TAKESHI (JP)
ISHIKAWA SEIICHI (JP)
KUBOTA KENJI (JP)
TAMAGAWA TAKASHI (JP)

International Classes:

C25D7/00; C25D5/12; C25D5/50; H01H85/06; H01R13/03

Foreign References:

JP4319247B1	2009-08-26
JP2009108389A	2009-05-21
JP2007063624A	2007-03-15
JP2007277715A	2007-10-25
JP2007258156A	2007-10-04
JP2007247060A	2007-09-27
JP2005344188A	2005-12-15
JP2000260230A	2000-09-22
JP2000054189A	2000-02-22

Attorney, Agent or Firm:

AOYAMA, MASAKAZU (JP)
Masakazu Aoyama (JP)

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