Title:
CONDUCTIVE MULTILAYER BODY, METHOD FOR PRODUCING CONDUCTIVE MULTILAYER BODY, AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2020/066658
Kind Code:
A1
Abstract:
The present invention provides: a conductive multilayer body which is able to be suppressed in mixing of air bubbles during bonding, and which is also able to be suppressed in the occurrence of appearance defects due to the generation of air bubbles and the occurrence of conduction failure due to disconnection of wiring in cases where folding of the conductive multilayer body is repeated in a bonded state; a touch panel; and a method for producing a conductive multilayer body. A conductive multilayer body 13 according to the present invention is provided with a supporting body 15 and conductive layers 16, 17 which are arranged on at least one surface of the supporting body 15. The conductive layers 16, 17 comprise resin layers 16B, 17B and conductive members 16A, 17A which are buried in the resin layers 16B, 17B; and the conductive layers 16, 17 have surfaces P1, P2 that have a height difference of 0.4 μm or less. The conductive members 16A, 17A contain a conductive component and a resin component; and the conductive members 16A, 17A are at least partially exposed in the surfaces P1, P2 of the conductive layers 16, 17.
Inventors:
NAKAHIRA SHINICHI (JP)
MURAKAMI RYOICHI (JP)
MURAKAMI RYOICHI (JP)
Application Number:
PCT/JP2019/035895
Publication Date:
April 02, 2020
Filing Date:
September 12, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G06F3/041; B32B27/18; G06F3/044; H05K3/22
Foreign References:
| JP2010034538A | 2010-02-12 | |||
| JP2009238851A | 2009-10-15 | |||
| JP2013033955A | 2013-02-14 | |||
| JP2016122517A | 2016-07-07 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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