Title:
CONDUCTIVE PAD DESIGN MODIFICATION FOR BETTER WAFER-PAD CONTACT
Document Type and Number:
WIPO Patent Application WO2006041889
Kind Code:
A3
Abstract:
An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad assembly is formed using a contact surface as a foundation that is coated with a metallic coating to create a conductive contact surface. In one embodiment, the metallic coating is a high purity tin/zinc alloy that is sprayed on the contact surface. The contact surface contains abrasive particles while the metallic coating provides at least conductive qualities to the contact surface.
More Like This:
| JPH04115864 | COATING METHOD |
| JPH11138426 | POLISHING DEVICE |
Inventors:
MAVLIEV RASHID A (US)
KARUPPIAH LAKSHMANAN (US)
KARUPPIAH LAKSHMANAN (US)
Application Number:
PCT/US2005/035768
Publication Date:
August 03, 2006
Filing Date:
October 05, 2005
Export Citation:
Assignee:
APPLIED MATERIALS INC (US)
MAVLIEV RASHID A (US)
KARUPPIAH LAKSHMANAN (US)
MAVLIEV RASHID A (US)
KARUPPIAH LAKSHMANAN (US)
International Classes:
B24B37/04; B24B37/22; B24B37/24; H01L21/321
Foreign References:
| US20040163946A1 | 2004-08-26 | |||
| US20040082289A1 | 2004-04-29 |
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