Title:
CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL, CIRCUIT-CONNECTING STRUCTURE, AND METHOD FOR CONNECTION OF CIRCUIT MEMBER
Document Type and Number:
WIPO Patent Application WO/2008/004367
Kind Code:
A1
Abstract:
A conductive particle comprising: a core particle having an electrical conductivity; and a insulating coating provided on the surface of the core particle and comprising an organic polymeric compound, wherein the conductive particle has a coverage ratio as defined by the formula (1) of 20 to 40%.
Inventors:
TANAKA MASARU (JP)
TAKETATSU JUN (JP)
TAKETATSU JUN (JP)
Application Number:
PCT/JP2007/057978
Publication Date:
January 10, 2008
Filing Date:
April 11, 2007
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
TANAKA MASARU (JP)
TAKETATSU JUN (JP)
TANAKA MASARU (JP)
TAKETATSU JUN (JP)
International Classes:
H01B5/00; C09J9/02; C09J11/00; C09J201/00; H01B1/20; H05K3/32
Foreign References:
| JPH0325955A | 1991-02-04 | |||
| JPH07105716A | 1995-04-21 | |||
| JP2004146261A | 2004-05-20 | |||
| JP2005203319A | 2005-07-28 | |||
| JP2005197091A | 2005-07-21 | |||
| JP2005149764A | 2005-06-09 | |||
| JPH08279371A | 1996-10-22 | |||
| JP2794009B2 | 1998-09-03 | |||
| JP2001195921A | 2001-07-19 |
Other References:
See also references of EP 2040268A4
Attorney, Agent or Firm:
HASEGAWA, Yoshiki et al. (Ginza First Bldg.10-6, Ginza 1-chome, Chuo-k, Tokyo 61, JP)
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