CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

Title:

CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2023/090525

Kind Code:

A1

Abstract:

The present invention relates to a conductive particle, which comprises: an insulation core; and a conductive layer including at least two elements on the insulation core, wherein at least two diffraction circles are formed in a diffraction pattern obtained by analyzing the conductive layer by using XRD.

Inventors:

KIM KYUNG HEUM (KR)
BAE CHANG WAN (KR)
KIM TAE GEUN (KR)
NAM HYUN HA (KR)

Application Number:

PCT/KR2021/019086

Publication Date:

May 25, 2023

Filing Date:

December 15, 2021

Export Citation:

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Assignee:

DUKSAN HI METAL CO LTD (KR)

International Classes:

H01B1/00; C08K3/08; H01B5/16

Foreign References:

KR20150099873A	2015-09-01
JP4451760B2	2010-04-14
KR101592057B1	2016-02-05
KR20200098486A	2020-08-20
US9202867B2	2015-12-01

Attorney, Agent or Firm:

TW INTERNATIONAL PATENT AND LAW FIRM (KR)

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