CONDUCTIVE PARTICLE, METHOD FOR MANUFACTURING CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

WIPO Patent Application WO/2011/115105

A1

Disclosed are conductive particles which can inhibit electrode corrosion and increase conductivity reliability between electrodes, and a connection structure which uses the conductive particles. The conductive particles (1) have a conductive layer (3) on at least the outer surface (1a) thereof. When a liquid, wherein 1g of the conductive particles (1) has been added to 10mL of an ion-exchanged water, is heated at 121˚C for 24 hours whilst being hermetically sealed, the concentration of organic acid in the water phase of the post-heating liquid is not greater than 300 μg/g in terms of conductive particles. The connection structure (21) is provided with a first member to be connected (22) having an electrode (22a), and a second member to be connected (23) having an electrode (23a), and a connection unit (24) which connects the first member to be connected (22) and the second member to be connected (23). The connection unit (24) is either formed from the conductive particles (1) or an anisotropic conductive material containing the conductive particles (1) and a binder resin. The electrodes (22a, 23a) are electrically connected by the conductive particles (1).

ISHIDA HIROYA (JP)
YUUKI AKIRA (JP)

PCT/JP2011/056042

September 22, 2011

March 15, 2011

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SEKISUI CHEMICAL CO LTD (JP)
ISHIDA HIROYA (JP)
YUUKI AKIRA (JP)

H01B5/00; G02F1/1345; H01B5/16; H01B13/00; H01L21/60; H01R11/01; H01B1/20

JP2003193020A	2003-07-09
JP2007299640A	2007-11-15

MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)

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