Title:
CONDUCTIVE PARTICLE WITH INSULATIVE PARTICLES ATTACHED THERETO, ANISOTROPIC CONDUCTIVE MATERIAL, AND CONNECTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2012/002508
Kind Code:
A1
Abstract:
Disclosed is a conductive particle with insulative particles attached thereto, wherein the insulative particles do not come off the surface of the conductive particle so easily, and hence, reliability in the conductivity thereof can be increased upon connecting electrodes therewith. The conductive particle (1) with insulative particles attached thereto is provided with: a conductive particle (2) that has a conductive layer (12) on at least the surface thereof; and insulative particles (3) adhered to the surface of the conductive particle (2). The insulative particle (3) is comprised of an insulative particle body (5); and a layer (6) covering at least a portion of the surface of the insulative particle body (5), and which is formed of a high polymer. The insulative particle body (5) and the layer (6) are chemically bonded.
Inventors:
MAHARA, Shigeo (2-1, Hyakuyama, Shimamoto-cho, Mishima-gu, Osaka 21, 〒6180021, JP)
Application Number:
JP2011/065095
Publication Date:
January 05, 2012
Filing Date:
June 30, 2011
Export Citation:
Assignee:
SEKISUI CHEMICAL CO., LTD. (4-4 Nishitemma 2-chome, Kita-ku Osaka-sh, Osaka 65, 〒5308565, JP)
積水化学工業株式会社 (〒65 大阪府大阪市北区西天満２丁目４番４号 Osaka, 〒5308565, JP)
積水化学工業株式会社 (〒65 大阪府大阪市北区西天満２丁目４番４号 Osaka, 〒5308565, JP)
International Classes:
H01B5/00; H01B1/22; H01B5/16; H01R11/01
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (Chuo Odori FN Bldg, 3-8 Tokiwamachi 1-chome,Chuo-ku, Osaka-shi, Osaka 28, 〒5400028, JP)
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Claims: