Title:
CONDUCTIVE PARTICLES, ANISOTROPIC CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2012/043472
Kind Code:
A1
Abstract:
Provided are: conductive particles, each of which is not susceptible to a large crack in a conductive layer even in cases where a large force is applied thereto; an anisotropic conductive material which uses the conductive particles; and a connection structure. Each one of conductive particles (1) of the present invention comprises a base particle (2) and a copper-tin layer (3) that is formed on a surface (2a) of the base particle (2). The copper-tin layer (3) contains an alloy of copper and tin. The amount of copper contained in the entire copper-tin layer (3) is more than 20% by weight but not more than 75% by weight, and the amount of tin contained therein is not less than 25% by weight but less than 80% by weight. An anisotropic conductive material of the present invention contains the conductive particles (1) and a binder resin. A connection structure of the present invention comprises a first member to be connected, a second member to be connected, and a connection part that connects the first and second members to be connected. The connection part is formed of the conductive particles (1) or the anisotropic conductive material that contains the conductive particles (1).
Inventors:
WANG XIAOGE (JP)
Application Number:
PCT/JP2011/071882
Publication Date:
April 05, 2012
Filing Date:
September 26, 2011
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
WANG XIAOGE (JP)
WANG XIAOGE (JP)
International Classes:
H01B5/00; C09J9/02; C09J11/02; C09J201/00; H01B5/16; H01L21/60; H01R11/01
Foreign References:
| JP2006225692A | 2006-08-31 | |||
| JP2008147642A | 2008-06-26 | |||
| JP2006059721A | 2006-03-02 | |||
| JP2007242307A | 2007-09-20 | |||
| JP2006228475A | 2006-08-31 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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