Title:
CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2013/094637
Kind Code:
A1
Abstract:
Provided are conductive particles which, when used to obtain a connection structure that forms a connection between electrodes, can reduce connection resistance between said electrodes, and inhibit increases in connection resistance between said electrodes under high temperatures and high humidities. Conductive particles (1) according to the present invention each have a base particle (2), and a conductive layer (3) disposed on the surface of the base particle (2). The conductive layer (3) includes a component of at least one type of metal from among nickel, tungsten, and molybdenum. The nickel content in 100 wt% of the whole conductive layer (3) is at least 60 wt%. The total content of tungsten and molybdenum in 100 wt% of a conductive-layer section having a thickness of 5nm from the outer surface of the conductive layer (3) inwards in the thickness direction is above 5 wt%.
Inventors:
NISHIOKA KEIZO (JP)
Application Number:
PCT/JP2012/082911
Publication Date:
June 27, 2013
Filing Date:
December 19, 2012
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B5/00; B22F1/16; B22F1/17; B22F1/18; C22C19/03; C23C18/50; H01B1/22; H01B5/16; H01R11/01
Foreign References:
| JP2002075057A | 2002-03-15 | |||
| JP2009224059A | 2009-10-01 | |||
| JPH07207185A | 1995-08-08 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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