Title:
CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2013/108842
Kind Code:
A1
Abstract:
Provided are conductive particles which are capable of effectively lowering the connection resistance in cases where the conductive particles are used for the electrical connection between electrodes.
A conductive particle (1) of the present invention comprises: a base particle (2); a first conductive layer (3) that is arranged on the surface of the base particle (2) and contains nickel and phosphorus; and a second conductive layer (4) that is arranged on the outer surface of the first conductive layer (3) and contains palladium.
Inventors:
WANG XIAOGE (JP)
Application Number:
PCT/JP2013/050821
Publication Date:
July 25, 2013
Filing Date:
January 17, 2013
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B5/00; C09J9/02; C09J11/00; C09J201/00; H01B1/22; H01B5/16; H01R11/01
Domestic Patent References:
| WO2011111152A1 | 2011-09-15 |
Foreign References:
| JP2012004034A | 2012-01-05 | |||
| JP2012004033A | 2012-01-05 | |||
| JP2010073578A | 2010-04-02 | |||
| JP2006228475A | 2006-08-31 | |||
| JP2011175951A | 2011-09-08 | |||
| JP2012178270A | 2012-09-13 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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Claims: