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Title:
CONDUCTIVE PARTICLES WITH ATTACHED INSULATING PARTICLES, METHOD FOR PRODUCING CONDUCTIVE PARTICLES WITH ATTACHED INSULATING PARTICLES, ANISOTROPIC CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2011/030715
Kind Code:
A1
Abstract:
Disclosed are conductive particles with attached insulating particles wherein detachment of the insulating particles from the surface of the conductive particles is difficult. Further disclosed is a method for producing said conductive particles with attached insulating particles. The conductive particles (1) with attached insulating particles are provided with conductive particles (2) having a conductive layer (5) on the surface (2a), and insulating particles (3) attached to the surface (2a) of the conductive particles (2). The insulating particles (3) have on the surface (3a) hydroxyl groups directly bonded to phosphorus atoms or hydroxyl groups directly bonded to silicon atoms. In the method for producing the conductive particles with attached insulating particles, the insulating particles (3) having on the surface (3a) hydroxyl groups directly bonded to phosphorus atoms or hydroxyl groups directly bonded to silicon atoms are attached to the surface (2a) of the conductive particles (2).

Inventors:
UENOYAMA, Shinya (1259, Izumi, Minakuchi-cho, Kouka-sh, Shiga 85, 〒5288585, JP)
上野山 伸也 (〒85 滋賀県甲賀市水口町泉1259 積水化学工業株式会社内 Shiga, 〒5288585, JP)
Application Number:
JP2010/065033
Publication Date:
March 17, 2011
Filing Date:
September 02, 2010
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO., LTD. (4-4 Nishitemma 2-chome, Kita-ku Osaka-sh, Osaka 65, 〒5308565, JP)
積水化学工業株式会社 (〒65 大阪府大阪市北区西天満2丁目4番4号 Osaka, 〒5308565, JP)
UENOYAMA, Shinya (1259, Izumi, Minakuchi-cho, Kouka-sh, Shiga 85, 〒5288585, JP)
International Classes:
H01B5/00; H01B1/22; H01B5/16; H01B13/00; H01R11/01
Attorney, Agent or Firm:
MIYAZAKI, Chikara et al. (6F Daido Seimei Bldg, 5-4 Tanimachi 1-chome, Chuo-ku, Osaka-sh, Osaka 12, 〒5400012, JP)
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