Title:
CONDUCTIVE PASTE, BASE HAVING CONDUCTIVE FILM OBTAINED USING SAME, AND METHOD FOR PRODUCING BASE HAVING CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2012/161201
Kind Code:
A1
Abstract:
Provided is a conductive paste which is capable of forming a conductive film that is able to maintain low volume resistivity for a long period of time, while being suppressed in the formation of an oxide coating film. A conductive paste which contains (A) copper particles, (B) a chelating agent which is composed of a compound that has a stability constant logKcu with copper ions of 5-15 at 25°C at an ionic strength of 0.1 mol/L, (C) a thermosetting resin and (D) an ester or amide of an organic acid having a pKa of 1-4. A conductive film is formed by applying the conductive paste onto a base and then heating and curing the conductive paste at a temperature of less than 150°C.
Inventors:
SUWA KUMIKO (JP)
HIRAKOSO HIDEYUKI (JP)
HIRAKOSO HIDEYUKI (JP)
Application Number:
PCT/JP2012/063100
Publication Date:
November 29, 2012
Filing Date:
May 22, 2012
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
SUWA KUMIKO (JP)
HIRAKOSO HIDEYUKI (JP)
SUWA KUMIKO (JP)
HIRAKOSO HIDEYUKI (JP)
International Classes:
H01B1/22; B22F1/10; B32B27/18; H01B1/00; H01B5/14; H01B13/00
Foreign References:
| JPH01158081A | 1989-06-21 | |||
| JP2002038053A | 2002-02-06 | |||
| JP2006128005A | 2006-05-18 | |||
| JP2000021235A | 2000-01-21 |
Attorney, Agent or Firm:
HAMADA Yuriko et al. (JP)
Yuriko Hamada (JP)
Yuriko Hamada (JP)
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Claims:
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