Title:
CONDUCTIVE PASTE, CURED PRODUCT, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/259905
Kind Code:
A1
Abstract:
A conductive paste according to the present invention comprises a conductive filler (a) and a binder (b), wherein the binder (b) includes a terminal hydroxyl group-containing polyalkylene glycol (meth)acrylate (b1).
Inventors:
KUSAKA KEIICHI (JP)
Application Number:
PCT/JP2022/022051
Publication Date:
December 15, 2022
Filing Date:
May 31, 2022
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C09J4/02; C09J9/02; C09J11/04; C09J133/04; H01L21/52
Foreign References:
| JP2015057825A | 2015-03-26 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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