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Patent Searching and Data


Title:
CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CONNECTION STRUCTURE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2017/188446
Kind Code:
A1
Abstract:
The objective of the invention is to obtain an electrode that is similar to a protruding electrode which independently stands on a base plate. The conductive paste (202) contains a conductive powder and an alcoholic liquid component, and contains no adhesive. The conductive powder contains conductive particles with a thickness of between 0.05 μm and 0.1 μm inclusive, and have a representative length, which is the maximum span in a plane orthogonal to the thickness direction, of between 5 μm and 10 μm inclusive. With respect to the conductive paste, the weight ratio of the alcoholic liquid component is between 8% and 20% inclusive.

Inventors:
SATOH TOMOTOSHI
SATO HIROYA
SUGANUMA KATSUAKI (JP)
SUETAKE AIJI (JP)
NAGAO SHIJO (JP)
JIU JINTING (JP)
KIHARA SEIICHIRO (JP)
Application Number:
PCT/JP2017/017032
Publication Date:
November 02, 2017
Filing Date:
April 28, 2017
Export Citation:
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Assignee:
SHARP KK (JP)
UNIV OSAKA (JP)
International Classes:
H01B1/20; B22F1/068; B22F1/107; H01B1/00; H01L21/60; H05K3/32
Domestic Patent References:
WO2007034893A12007-03-29
Foreign References:
JP2014111800A2014-06-19
JP2013216919A2013-10-24
JP2009170277A2009-07-30
JP2015071818A2015-04-16
JP2001319523A2001-11-16
JP2016093830A2016-05-26
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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