Title:
CONDUCTIVE PASTE FOR ELECTRON BEAM CURING AND METHOD FOR PRODUCING CIRCUIT BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/015155
Kind Code:
A1
Abstract:
This invention is a conductive paste for electron beam curing comprising a conductive powder, a radical-polymerizable composition, a plasticizer, and a dispersant; the plasticizer is added at a rate of 5 to 20 parts by mass per 100 parts by mass of the radical-polymerizable composition and the dispersant is a cationic dispersant.
Inventors:
KOSHIMIZU KAZUTOSHI (JP)
TORII JUNICHI (JP)
OTA SHIGEO (JP)
TORII JUNICHI (JP)
OTA SHIGEO (JP)
Application Number:
PCT/JP2012/068098
Publication Date:
January 31, 2013
Filing Date:
July 17, 2012
Export Citation:
Assignee:
FUJIKURA LTD (JP)
GOO CHEMICAL CO LTD (JP)
KOSHIMIZU KAZUTOSHI (JP)
TORII JUNICHI (JP)
OTA SHIGEO (JP)
GOO CHEMICAL CO LTD (JP)
KOSHIMIZU KAZUTOSHI (JP)
TORII JUNICHI (JP)
OTA SHIGEO (JP)
International Classes:
H01B1/22; C08F2/54; C08J7/043; C08J7/044; C08J7/046; C09D5/24; H01B13/00; H05K3/10
Foreign References:
| JP2010192289A | 2010-09-02 | |||
| JPH06228442A | 1994-08-16 | |||
| JP2007131754A | 2007-05-31 | |||
| JP2011150897A | 2011-08-04 |
Attorney, Agent or Firm:
AOKI Hiroaki et al. (JP)
Hiroaki Aoki (JP)
Hiroaki Aoki (JP)
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Claims: