Title:
CONDUCTIVE PASTE, ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2013/128957
Kind Code:
A1
Abstract:
This conductive paste contains a metal powder, a glass frit containing an Si component, and an organic vehicle. The metal powder has a flat shape wherein the ratio of the maximum length (a) to the maximum thickness (b), namely a/b is 2.5 or more; the molar quantity of SiO2 contained in the glass frit is 36-59% by mole; and the volumetric content of the glass frit is 6-11% by volume. External electrodes (5a, 5b) of a multilayer ceramic capacitor, said external electrodes using this conductive paste, have a molar quantity of SiO2 contained in a glass phase (10) of 38-60% by mole, an area occupancy by the glass phase (10) of 30-60%, and a maximum length (c) of the glass phase (10) of 5 μm or less. Consequently, there are provided: a conductive paste that is suitable for the formation of an external electrode; an electronic component such as a multilayer ceramic capacitor wherein moisture resistance and plating liquid resistance are able to be ensured without causing a structural defect and good plating adhesion is achieved even in cases where the external electrodes are reduced in the thickness; and a method for producing the electronic component.
Inventors:
KISUMI TETSUYA (JP)
NAGAMOTO TOSHIKI (JP)
NISHISAKA YASUHIRO (JP)
OKABE YOKO (JP)
NAGAMOTO TOSHIKI (JP)
NISHISAKA YASUHIRO (JP)
OKABE YOKO (JP)
Application Number:
PCT/JP2013/050449
Publication Date:
September 06, 2013
Filing Date:
January 11, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01B1/22; H01B1/00; H01G4/232; H01G4/30
Foreign References:
| JP2005228610A | 2005-08-25 | |||
| JP2005268204A | 2005-09-29 | |||
| JP2000252158A | 2000-09-14 |
Attorney, Agent or Firm:
KUNIHIRO YASUTOSHI (JP)
Kunihiro Yasutoshi (JP)
Kunihiro Yasutoshi (JP)
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Claims: