CONDUCTIVE PASTE FOR EXTERNAL ELECTRODE, AND MULTILAYER CERAMIC ELECTRONIC COMPONENT COMPRISING EXTERNAL ELECTRODE WHICH IS FORMED USING SAME

Title:

CONDUCTIVE PASTE FOR EXTERNAL ELECTRODE, AND MULTILAYER CERAMIC ELECTRONIC COMPONENT COMPRISING EXTERNAL ELECTRODE WHICH IS FORMED USING SAME

Document Type and Number:

WIPO Patent Application WO/2010/074119

Kind Code:

A1

Abstract:

Disclosed is a conductive paste for an external electrode, which enables a multilayer ceramic electronic component to have good electrical characteristics (electrical capacitance, tan δ) when an external electrode of the multilayer ceramic electronic component is formed from the conductive paste. Specifically disclosed is a conductive paste for an external electrode, which contains (A) metal particles having an average particle diameter of 0.2-30 μm and a melting point of not less than 700˚C, (B) metal particles having an average particle diameter of 0.2-18 μm and a melting point of 200˚C or more but less than 700˚C, (C) a paste which is obtained by mixing one or more copper-containing compounds selected from a group consisting of copper nitrate, copper cyanide, copper octanoate, copper formate, copper acetate, copper oxalate, copper benzoate and copper acetylacetonate, an amino compound, and if necessary, an organic solvent, and (D) a thermosetting resin.

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Inventors:

IKARASHI SENICHI
MARUYAMA HIROKI
SASAKI KOJI
SUGATA HIRONORI

Application Number:

PCT/JP2009/071391

Publication Date:

July 01, 2010

Filing Date:

December 24, 2009

Export Citation:

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Assignee:

NAMICS CORP (JP)
IKARASHI SENICHI
MARUYAMA HIROKI
SASAKI KOJI
SUGATA HIRONORI

International Classes:

H01B1/22; H01B1/00; H01G4/228; H01G4/252

Domestic Patent References:

WO2007072894A1

2007-06-28

Foreign References:

JP2002329419A	2002-11-15
JPH0912677A	1997-01-14
JPH10154417A	1998-06-09
JP2006059765A	2006-03-02

Attorney, Agent or Firm:

TSUKUNI, HAJIME (JP)
Hajime Tsukuni (JP)

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