Title:
CONDUCTIVE PASTE, CONDUCTIVE FILM, AND METHOD FOR PRODUCING CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2020/240733
Kind Code:
A1
Abstract:
Provided is a technology that relates to a conductive paste which is obtained at low cost, while having high electrical conductivity. A conductive paste which contains a conductive filler, a polymer and a solvent, wherein the conductive filler contains bicontinuous fibrous carbon that is a branched carbon having a three-dimensional network structure.
Inventors:
NOHARA MASAYA (JP)
MINOWA HIRONOBU (JP)
IWATA MIKAYO (JP)
TAGUCHI HIROAKI (JP)
KOMATSU TAKESHI (JP)
MINOWA HIRONOBU (JP)
IWATA MIKAYO (JP)
TAGUCHI HIROAKI (JP)
KOMATSU TAKESHI (JP)
Application Number:
PCT/JP2019/021303
Publication Date:
December 03, 2020
Filing Date:
May 29, 2019
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE (JP)
International Classes:
H01B1/20; H01B5/14
Domestic Patent References:
| WO2016009935A1 | 2016-01-21 |
Foreign References:
| JP2013093518A | 2013-05-16 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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