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Title:
CONDUCTIVE PASTE AND CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2015/099049
Kind Code:
A1
Abstract:
Provided is a conductive paste containing: a binder resin containing at least an aromatic polyimide resin (A) having a phenolic hydroxyl group and an ether linkage in a skeleton, and conductive particles. The polyimide resin (A) is preferably the resin of formula (1). (R1 represents formula (2), R2 represents formula (3), and R3 represents a divalent aromatic group having at least one of the structures illustrated in formula (4).

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Inventors:
ISHIKAWA KAZUNORI (JP)
MIZUTANI GO (JP)
SEGAWA JUNICHI (JP)
Application Number:
PCT/JP2014/084325
Publication Date:
July 02, 2015
Filing Date:
December 25, 2014
Export Citation:
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Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
H01B1/22; C08G73/10; C09D5/24; C09D7/61; C09D163/00; C09D179/08; H01B1/00; H01B5/16
Foreign References:
JP2010126725A2010-06-10
JP2013149528A2013-08-01
Attorney, Agent or Firm:
PATENTBOX IP LAW FIRM (JP)
Patent business corporation patent box (JP)
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