Title:
CONDUCTIVE PASTE, LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING LAMINATED CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2013/157516
Kind Code:
A1
Abstract:
Provided is a conductive paste which has good printability, shows a high filling ratio of a conductive metal powder in a conductive paste film after printing, and, after baking, enables the formation of a conductor film (an internal electrode) that has high flatness and high continuity and leaves little residue. Also provided is a highly reliable laminated ceramic electronic component provided with an internal electrode that is formed using the conductive paste.
The conductive paste comprises a conductive metal powder, an organic solvent and an acrylic resin, wherein the average particle size of the conductive metal powder is 50-200 nm, the weight-average molecular weight of the acrylic resin is 160,000-1,000,000 and the content of the acrylic resin is within a range of 20-200 vol% relative to the metal powder.
The conductive paste further comprises a ceramic powder the average particle diameter of which is preferably 5-100 nm.
As the conductive metal powder, at least one kind of powder selected from the group consisting of copper, nickel, silver and palladium or a powder of an alloy that comprises at least one kind of metal selected from the aforesaid group is used.
Inventors:
OCHI HIROAKI (JP)
OGATA NAOAKI (JP)
OGATA NAOAKI (JP)
Application Number:
PCT/JP2013/061172
Publication Date:
October 24, 2013
Filing Date:
April 15, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01B1/22; C09D5/24; C09D7/12; C09D133/00; H01G4/232; H01G4/30
Foreign References:
| JP2005158563A | 2005-06-16 | |||
| JP2011018848A | 2011-01-27 | |||
| JP2004183027A | 2004-07-02 | |||
| JP2005064494A | 2005-03-10 |
Attorney, Agent or Firm:
NISHIZAWA, HITOSHI (JP)
Hitoshi Nishizawa (JP)
Hitoshi Nishizawa (JP)
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