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Patent Searching and Data


Title:
CONDUCTIVE PASTE, METHOD FOR FORMING CONDUCTIVE PATTERN, AND GLASS ARTICLE
Document Type and Number:
WIPO Patent Application WO/2017/159055
Kind Code:
A1
Abstract:
This conductive paste contains a conductive powder, a glass frit 6 and an organic vehicle that is composed of an organic binder and an organic solvent, and additionally contains a resin powder that is insoluble in the organic vehicle and is burned down by a firing treatment. A dried film obtained by applying and drying this conductive paste is subjected to a firing treatment, thereby forming a conductive film 2 in a predetermined pattern on a glass substrate 1, while having the resin powder burned down at the same time so that a void 9 is formed in the burned-out space of the resin powder for ventilation of a decomposed gas of the organic binder. A glass article such as antifogging glass and glass with an antenna is obtained using this conductive paste. Consequently, the present invention enables the achievement of: a conducive paste which is capable of ensuring good adhesion to a substrate, while ensuring a desired low resistivity; a method for forming a conductive pattern with use of this conductive paste; and a glass article such as antifogging glass and glass with an antenna, which is obtained using this conductive paste.

Inventors:
TSUGIMOTO SHINICHI (JP)
Application Number:
PCT/JP2017/002480
Publication Date:
September 21, 2017
Filing Date:
January 25, 2017
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01B1/22; C03C17/04; H01B13/00; H01Q1/32; H05K1/09
Domestic Patent References:
WO2005048667A12005-05-26
WO2010116851A12010-10-14
Foreign References:
JP2009245704A2009-10-22
JP2005191310A2005-07-14
JPH10172345A1998-06-26
Attorney, Agent or Firm:
KUNIHIRO Yasutoshi (JP)
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