CONDUCTIVE PASTE AND METHOD FOR MANUFACTURING CONDUCTIVE FILM USING SAME

Title:

CONDUCTIVE PASTE AND METHOD FOR MANUFACTURING CONDUCTIVE FILM USING SAME

Document Type and Number:

WIPO Patent Application WO/2015/087989

Kind Code:

A1

Abstract:

This conductive paste includes: copper fine particles having an average particle size of 1 to 100 nm and covered by an azole compound such as benzotriazole; copper coarse particles having an average particle size of 0.3 to 20 μm; a glycol-based solvent such as ethylene glycol; and at least one of polyvinyl pyrrolidone (PVP) resin and polyvinyl butyral (PVB) resin. The total amount of copper fine particles and copper coarse particles is 50 to 90 mass% with a mass ratio of 1:9 to 5:5. Said conductive paste is applied to a substrate by screen printing, pre-baked by vacuum drying, and then irradiated with light having a wavelength of 200 to 800 nm at a pulse voltage of 1600 to 3800 V and a pulse cycle of 500 to 2000 μs. A conductive film is thus formed upon the substrate by light irradiation and baking.

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Inventors:

KANEDA SHUJI (JP)
FUJITA HIDEFUMI (JP)
ITOH DAISUKE (JP)

Application Number:

PCT/JP2014/082904

Publication Date:

June 18, 2015

Filing Date:

December 05, 2014

Export Citation:

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Assignee:

DOWA ELECTRONICS MATERIALS CO (JP)

International Classes:

H01B1/22; B22F1/054; B22F1/102; C08L29/14; C08L39/06; C09D5/24; C09D7/45; C09D7/62; C09D11/106; C09D11/52; C09D129/14; C09D139/06; H01B1/00; H01B13/00; H05K1/09; H05K3/12

Foreign References:

JP2010021101A	2010-01-28
JP2004211108A	2004-07-29
JP2007258123A	2007-10-04
JP2012243655A	2012-12-10
JP2013161544A	2013-08-19
JP2014225338A	2014-12-04
JPH09218508A	1997-08-19
JP2010528428A	2010-08-19
JP2008285761A	2008-11-27

Other References: