Title:
CONDUCTIVE PASTE FOR OFFSET PRINTING
Document Type and Number:
WIPO Patent Application WO/2012/014481
Kind Code:
A1
Abstract:
The disclosed conductive paste for offset printing is highly suited to offset printing and makes it possible to form high-precision wiring patterns. Said conductive paste contains an organic binder resin, a conductive powder, and an organic solvent that contains 30-90% by mass of a high-boiling-point solvent that has a boiling point of 250-330°C at 760 mmHg.
Inventors:
SASAKI, Masaki (C/O TAIYO HOLDINGS CO. LTD, Ranzan Facility, 388, Oaza Okura, Ranzanmachi, Hiki-gu, Saitama 22, 〒3550222, JP)
佐々木 正樹 (〒22 埼玉県比企郡嵐山町大字大蔵３８８番地太陽ホールディングス株式会社 嵐山事業所内 Saitama, 〒3550222, JP)
佐々木 正樹 (〒22 埼玉県比企郡嵐山町大字大蔵３８８番地太陽ホールディングス株式会社 嵐山事業所内 Saitama, 〒3550222, JP)
Application Number:
JP2011/004279
Publication Date:
February 02, 2012
Filing Date:
July 28, 2011
Export Citation:
Assignee:
TAIYO HOLDINGS CO., LTD. (7-1 Hazawa 2-chome, Nerima-ku Tokyo, 08, 〒1768508, JP)
太陽ホールディングス株式会社 (〒08 東京都練馬区羽沢二丁目７番１号 Tokyo, 〒1768508, JP)
SASAKI, Masaki (C/O TAIYO HOLDINGS CO. LTD, Ranzan Facility, 388, Oaza Okura, Ranzanmachi, Hiki-gu, Saitama 22, 〒3550222, JP)
太陽ホールディングス株式会社 (〒08 東京都練馬区羽沢二丁目７番１号 Tokyo, 〒1768508, JP)
SASAKI, Masaki (C/O TAIYO HOLDINGS CO. LTD, Ranzan Facility, 388, Oaza Okura, Ranzanmachi, Hiki-gu, Saitama 22, 〒3550222, JP)
International Classes:
C09D11/02; H01B1/22; H01B5/14; H01B13/00
Attorney, Agent or Firm:
AMAGI INTERNATIONAL PATENT LAW OFFICE (SOLID SQUARE EAST TOWER 4F, 580 Horikawa-cho,Saiwai-ku, Kawasaki-shi, Kanagawa 13, 〒2120013, JP)
Claims:
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