Title:
CONDUCTIVE PASTE FOR PILLAR FORMATION
Document Type and Number:
WIPO Patent Application WO/2020/003725
Kind Code:
A1
Abstract:
In the conventional method of electroplating, the difficulty of forming fine pillars without being affected by undercutting was problematic. Further, in electroless plating, the difficulty of forming pillars of the same shape without voids was problematic. Here, by using this conductive pillar formation paste to produce pillars by embedding, the present invention aims to enable preventing undercutting and to provide metal pillars of the same shape with excellent reproducibility. A conductive paste which consists of fine metal microparticles and is characterized by having a specific microparticle content ratio was found to be particularly effective in pillar formation.
Inventors:
YAMAGUCHI RYOTA (JP)
SEKINE NOBUHIRO (JP)
YADA MAKOTO (JP)
SANO YOSHIYUKI (JP)
SEKINE NOBUHIRO (JP)
YADA MAKOTO (JP)
SANO YOSHIYUKI (JP)
Application Number:
PCT/JP2019/017602
Publication Date:
January 02, 2020
Filing Date:
April 25, 2019
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
H01L21/60; B22F1/0545; B22F1/102; B22F1/107; B22F9/24; H01B1/22; B22F1/17
Foreign References:
| JP2014111800A | 2014-06-19 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
Download PDF: