Title:
CONDUCTIVE PASTE, THREE-DIMENSIONAL PRINTED CIRCUIT, TOUCH SENSOR, AND METHODS RESPECTIVELY FOR PRODUCING THOSE PRODUCTS
Document Type and Number:
WIPO Patent Application WO/2019/039209
Kind Code:
A1
Abstract:
Provided is a conductive paste which can prevent the disconnection of a conductive part which can be caused upon the thermal stretching during molding. A conductive paste for molding processing use can be produced by mixing and dispersing aggregated silver particles, a resin having a glass transition temperature of 80°C or lower, a curing agent and a solvent together. It is preferred that the aggregated silver particles to be contained have a tap density of 2 to 5 g/cm3 and a specific surface area of 0.5 to 2.0 m2/g, the primary particle diameter of the aggregated silver particles is 0.1 to 3 μm when the particle diameters of the aggregated silver particles are measured with a scanning electron microscope, and the resin has a glass transition temperature of 60°C or lower and a number average molecular weight of 5000 to 40000. The conductive paste is suitable for use applications where the whole body of a base material is thermally deformed to form a three-dimensional circuit after the formation of a printed circuit, and is particularly suitable for the formation of a fine wire for a touch sensor.
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Inventors:
TAGA KEIKO (JP)
Application Number:
PCT/JP2018/028585
Publication Date:
February 28, 2019
Filing Date:
July 31, 2018
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
H01B1/22; C08K3/04; C08K3/08; C08L101/12; H01B5/14; H01B13/00; H05K3/12
Domestic Patent References:
| WO2017081948A1 | 2017-05-18 |
Foreign References:
| JP2001319524A | 2001-11-16 | |||
| JP2014510319A | 2014-04-24 | |||
| JP2008262981A | 2008-10-30 | |||
| JP2018041692A | 2018-03-15 | |||
| JP2014531490A | 2014-11-27 |
Other References:
See also references of EP 3675139A4
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