Title:
CONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2017/038572
Kind Code:
A1
Abstract:
Provided is a conductive paste which is capable of suppressing the occurrence of a large void in a bonded portion even in cases where a relatively large chip is bonded to a substrate. A conductive paste which contains: a metal powder having an average particle diameter of 0.5-10 μm; fine metal particles; a coating agent covering the surfaces of the fine metal particles; and a solvent in which the metal powder and the fine metal particles are dispersed. The average particle diameter of the fine metal particles, including the coating agent adhering to the surfaces of the fine metal particles, is 1-50 nm. The coating agent is a compound having 6-20 carbon atoms and a carboxyl structure. The solvent is a compound that has at least one structure selected from the group consisting of a hydroxyl structure, an ester structure and an ether structure.
Inventors:
NAKAJO HARUYUKI (JP)
Application Number:
PCT/JP2016/074621
Publication Date:
March 09, 2017
Filing Date:
August 24, 2016
Export Citation:
Assignee:
HARIMA CHEMICALS INC (JP)
International Classes:
H01B1/22; B22F1/102; B22F9/00; C09J9/02; C09J11/02; H01B1/00; H01B5/14; H05K3/12
Foreign References:
| JP2014111800A | 2014-06-19 | |||
| JP2014055332A | 2014-03-27 | |||
| JP2011068988A | 2011-04-07 | |||
| JP2014047413A | 2014-03-17 | |||
| JP2005174828A | 2005-06-30 |
Attorney, Agent or Firm:
MIYAZAKI, Teruo et al. (JP)
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