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Title:
CONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2018/025627
Kind Code:
A1
Abstract:
A conductive paste which is characterized by containing a conductive powder, a glass frit that does not substantially contain lead, and an organic vehicle, and which is also characterized in that the glass frit contains one or two constituents selected from the group consisting of 25-50% by mole of B in terms of B2O3, 25-50% by mole of Si in terms of SiO2, 7-23% by mole of Al in terms of Al2O3, 2-15% by mole of Mg in terms of MgO, 2-5% by mole of Ba in terms of BaO, 3-18% by mole of Zn in terms of ZnO and 3-8% by mole of Ti in terms of TiO2 relative to the total number of moles in terms of the above-described oxides. The present invention is able to provide a lead-free conductive paste which has excellent solder melting resistance and oxidation resistance, and which is capable of forming a fired film that exhibits excellent bondability and adhesion to a base.

Inventors:
TATENO Hayato (Tosu Plant 5-3, Aza-wakazakura, Fujinoki-machi, Tosu-sh, Saga 48, 〒8410048, JP)
IKUNO Junichi (Tosu Plant 5-3, Aza-wakazakura, Fujinoki-machi, Tosu-sh, Saga 48, 〒8410048, JP)
MASHIMA Hiroshi (Tosu Plant 5-3, Aza-wakazakura, Fujinoki-machi, Tosu-sh, Saga 48, 〒8410048, JP)
Application Number:
JP2017/025950
Publication Date:
February 08, 2018
Filing Date:
July 18, 2017
Export Citation:
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Assignee:
SHOEI CHEMICAL INC. (1-1 Nishishinjuku 2-chome, Shinjuku-ku Tokyo, 43, 〒1630443, JP)
International Classes:
H01B1/22; C03C8/04; C03C8/18; H01C17/065
Domestic Patent References:
2007-09-13
Foreign References:
JP2012059547A2012-03-22
JP2012022841A2012-02-02
JP2001297628A2001-10-26
JPH076623A1995-01-10
JP2015041741A2015-03-02
JP2013236092A2013-11-21
JPH0794306A1995-04-07
JP2008085034A2008-04-10
Attorney, Agent or Firm:
ASHITABA INTERNATIONAL PATENT OFFICE (Kaede Bldg. 2F, 2-3-6 Uchikanda, Chiyoda-k, Tokyo 47, 〒1010047, JP)
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