Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2019/188289
Kind Code:
A1
Abstract:
Provided is a conductive paste that is suitable for forming fine wiring. The conductive paste according to an embodiment of the present invention comprises (A) a conductive powder, (B) a binder resin, (C) cellulose nanofibers, and (D) an organic solvent. The wiring according to an embodiment of the present invention is formed by curing the conductive paste.

Inventors:
YOSHIOKA Takuyua (LTD 55, Nishishichijo Higashikubo-cho, Shimogyo-ku, kyoto-sh, Kyoto 73, 〒6008873, JP)
Application Number:
JP2019/010269
Publication Date:
October 03, 2019
Filing Date:
March 13, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DAI-ICHI KOGYO SEIYAKU CO., LTD. (55 Nishishichijo Higashikubo-cho, Shimogyo-ku kyoto-sh, Kyoto 73, 〒6008873, JP)
International Classes:
H01B1/22; C08K3/08; C08K9/02; C08L1/00; C08L101/00; H01B1/00; H01B5/14; H05K3/12
Foreign References:
JP2013249448A2013-12-12
JP2012084440A2012-04-26
JP2018195540A2018-12-06
Download PDF: