Title:
CONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2020/066968
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a conductive paste which enables a conductor that is obtained after firing of the conductive paste to achieve a good balance between low resistance and high adhesive strength (die shear strength). The present invention provides conductive paste which contains: (A) copper fine particles that have an average particle diameter of from 50 nm to 400 nm (inclusive), while having a crystallite diameter of from 20 nm to 50 nm (inclusive); (B) copper particles that have an average particle diameter of from 0.8 μm to 5 μm (inclusive), while having a ratio of the crystallite diameter thereof to the crystallite diameter of the copper fine particles (A) of from 1.0 to 2.0 (inclusive); and (C) a solvent.
Inventors:
KAJITA MASASHI (JP)
KITAMURA MASAHIRO (JP)
HIGUCHI TAKAYUKI (JP)
MIZUMURA NORITSUKA (JP)
KITAMURA MASAHIRO (JP)
HIGUCHI TAKAYUKI (JP)
MIZUMURA NORITSUKA (JP)
Application Number:
PCT/JP2019/037179
Publication Date:
April 02, 2020
Filing Date:
September 24, 2019
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
H01B1/22; B22F1/052; B22F1/054; B22F1/107; B22F9/00; H01B1/00; H01L21/52
Domestic Patent References:
| WO2016031860A1 | 2016-03-03 |
Foreign References:
| JP2017041645A | 2017-02-23 | |||
| JPH1021744A | 1998-01-23 | |||
| JP2006183072A | 2006-07-13 | |||
| JP2014167145A | 2014-09-11 | |||
| JP2018183879A | 2018-11-22 |
Other References:
See also references of EP 3859751A4
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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