Title:
CONDUCTIVE PATTERN FORMING FILM, AND CONDUCTIVE PATTERN FORMING METHOD AND CONDUCTIVE PATTERN FORMING APPARATUS FOR THE CONDUCTIVE PATTERN FORMING FILM
Document Type and Number:
WIPO Patent Application WO/2008/047823
Kind Code:
A1
Abstract:
A conductive pattern forming film is provided for forming a conductive pattern
on a flexible general plastic substrate by a simple process and for easily forming
the conductive pattern by using an apparatus that performs a simple process of
pressurization at a low temperature. A conductive pattern forming method and
a conductive pattern forming apparatus for such film are also provided. The
conductive pattern forming film is provided by arranging on the flexible film
substrate a pattern which is formed by applying pressure while heating a conductive
paste applied by diffusion of a powdery material or fine particles of a metal or
a semiconductor. The conductive pattern forming apparatus is composed of a
sample arranging table having a flat placing surface, and a pressurizing driving
body movably arranged to the placing surface by facing the surface. The pressurizing
driving body has a supporting base composed of a metal flat plate having a metal
spherical body on the lower surface.
Inventors:
KAMATA, Toshihide (Higashi1-chome Tsukuba-sh, Ibaraki 65, 3058565, JP)
鎌田 俊英 (〒65 茨城県つくば市東１－１－１ 中央第５ 独立行政法人産業技術総合研究所内 Ibaraki, 3058565, JP)
鎌田 俊英 (〒65 茨城県つくば市東１－１－１ 中央第５ 独立行政法人産業技術総合研究所内 Ibaraki, 3058565, JP)
Application Number:
JP2007/070230
Publication Date:
April 24, 2008
Filing Date:
October 17, 2007
Export Citation:
Assignee:
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (3-1 Kasumigaseki 1-chome, Chiyoda-ku Tokyo, 21, 1008921, JP)
独立行政法人産業技術総合研究所 (〒21 東京都千代田区霞が関１丁目３番１号 Tokyo, 1008921, JP)
KAMATA, Toshihide (Higashi1-chome Tsukuba-sh, Ibaraki 65, 3058565, JP)
独立行政法人産業技術総合研究所 (〒21 東京都千代田区霞が関１丁目３番１号 Tokyo, 1008921, JP)
KAMATA, Toshihide (Higashi1-chome Tsukuba-sh, Ibaraki 65, 3058565, JP)
International Classes:
H01B5/14; H01B13/00
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