Title:
CONDUCTIVE POLYMER COMPOSITION, SUBSTRATE, AND METHOD FOR PRODUCING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/205873
Kind Code:
A1
Abstract:
The present invention is a conductive polymer composition characterized by having a composite of a π-conjugated polymer (A) and a polymer (B) represented by general formula (2) dispersed in H2O (D), and by including a water-soluble organic solvent (C). As a result of having this configuration, the present invention provides a composition that has suitable filterability and film formation properties and in which it possible to lessen acidity. By mixing an organic solvent into an H2O dispersion liquid of conductive polymer compounds that make it possible to form a conductive film having high transparency, leveling properties on a substrate are imparted as a result of a decrease in the surface tension and the contact angle, and the conductive polymer composition can be used in coating methods involving droplets. By using an organic solvent having a higher boiling point than H2O as the organic solvent, it is possible to avoid the precipitation of solids around a nozzle and the precipitation of solids due to drying in the interval from when a liquid material is discharged from a nozzle tip until said liquid material adheres to a substrate.
Inventors:
NAGASAWA TAKAYUKI (JP)
HATAKEYAMA JUN (JP)
HATAKEYAMA JUN (JP)
Application Number:
PCT/JP2021/012125
Publication Date:
October 14, 2021
Filing Date:
March 24, 2021
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08G61/12; C08F212/14; C08F220/22; C08F220/38; C08G73/02; C08L25/18; C08L33/14; C08L65/00; C08L101/12; H01B1/12; H01B1/20; H01B5/14
Domestic Patent References:
| WO2003048228A1 | 2003-06-12 |
Foreign References:
| JP2016188350A | 2016-11-04 | |||
| JP2019099766A | 2019-06-24 | |||
| JP2016069636A | 2016-05-09 | |||
| JP2017061631A | 2017-03-30 | |||
| JP2020128472A | 2020-08-27 | |||
| JP2008146913A | 2008-06-26 | |||
| EP1373356A1 | 2004-01-02 | |||
| JP2005068166A | 2005-03-17 | |||
| JP2008546899A | 2008-12-25 | |||
| JP6483518B2 | 2019-03-13 | |||
| JPH0150666B2 | 1989-10-31 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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