Title:
CONDUCTIVE RESIN COMPOSITION, CONDUCTIVE ADHESIVE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/090757
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a low-temperature rapid-curing type low-elasticity conductive adhesive that is useful as a conductive adhesive for mounting components used in the field of FHE. This conductive resin composition is characterized by containing (A) at least two types of urethane acrylate oligomers, (B) a radical-polymerizable monomer, (C) free radical-generating curing agent, and (D) conductive particles. In the conductive resin composition, component (A) preferably contains (A1) a high molecular weight urethane acrylate oligomer having a weight average molecular weight equal to or greater than 10000, and (A2) a low molecule weight urethane acrylate oligomer having a weight average molecular weight equal to or less than 9999.
Inventors:
KAPOGLIS YOLANDA IRMA (US)
OTOMO MASAYOSHI (JP)
OTOMO MASAYOSHI (JP)
Application Number:
PCT/JP2019/042214
Publication Date:
May 07, 2020
Filing Date:
October 28, 2019
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08F290/06; C09J9/02; C09J11/04; C09J175/14; H01L21/52
Domestic Patent References:
| WO2009128530A1 | 2009-10-22 | |||
| WO2018003704A1 | 2018-01-04 |
Foreign References:
| JP2006022312A | 2006-01-26 | |||
| JPS60252665A | 1985-12-13 | |||
| JPH07157523A | 1995-06-20 | |||
| JP2012072238A | 2012-04-12 | |||
| JP2016025305A | 2016-02-08 | |||
| JP2017210457A | 2017-11-30 | |||
| JP2018027944A | 2018-02-22 |
Attorney, Agent or Firm:
TAKEUCHI, ICHIZAWA & ASSOCIATES (JP)
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