Title:
CONDUCTIVE RESIN COMPOSITION, MATERIAL HAVING HIGH THERMAL CONDUCTIVITY, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/276690
Kind Code:
A1
Abstract:
A conductive resin composition according to the present invention includes (A) silver-containing particles, and (B) a trifunctional or higher aliphatic epoxy compound, wherein the content of (A) the silver-containing particles is at least 81 mass%.
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Inventors:
KASHINO TOMOMASA (JP)
HAMASHIMA AZUMI (JP)
YOSHIDA MASATO (JP)
WATABE NAOKI (JP)
TAKAMOTO MAKOTO (JP)
HAMASHIMA AZUMI (JP)
YOSHIDA MASATO (JP)
WATABE NAOKI (JP)
TAKAMOTO MAKOTO (JP)
Application Number:
PCT/JP2022/024078
Publication Date:
January 05, 2023
Filing Date:
June 16, 2022
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C09J163/00; C08K3/08; C08L63/00; H01B1/00; H01B1/22; H01B5/14; H01L21/52
Domestic Patent References:
| WO2014119463A1 | 2014-08-07 | |||
| WO2013147047A1 | 2013-10-03 |
Foreign References:
| JP2014531495A | 2014-11-27 | |||
| JP2015160932A | 2015-09-07 | |||
| JP2014034589A | 2014-02-24 | |||
| CN107446520A | 2017-12-08 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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