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Title:
CONDUCTIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/005149
Kind Code:
A1
Abstract:
Provided according to the present disclosure is a conductive resin composition that suppresses generation of outgas. The present disclosure relates to a conductive resin composition containing the following components (A)-(D). Component (A): bisphenol epoxy resin, component (B): epoxy resin having a boiling point of 300°C or higher (excluding component (A)), component (C): conductive particles, component (D): epoxy resin curing agent

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Inventors:
ENDO SATORU (JP)
NEMOTO TAKASHI (JP)
SUZUKI TAKASHI (JP)
Application Number:
PCT/JP2023/024208
Publication Date:
January 04, 2024
Filing Date:
June 29, 2023
Export Citation:
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Assignee:
THREE BOND CO LTD (JP)
International Classes:
C08G59/20; C08K3/08; C08L63/00; H01B1/22
Domestic Patent References:
WO2016088540A12016-06-09
Foreign References:
JP2006008775A2006-01-12
JP2021107475A2021-07-29
JP2018131569A2018-08-23
Attorney, Agent or Firm:
IBC (JP)
Download PDF:
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