Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CONDUCTIVE ROLLER AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2011/074610
Kind Code:
A1
Abstract:
Disclosed is a conductive roller during manufacture of which dripping of coating material, and in particular of a water-based coating material, is suppressed; also disclosed is a manufacturing method thereof. The conductive roller is provided with a shaft (1), at least one elastic layer (2) formed on the outer circumference of the shaft (1), and a surface layer (3) formed on the outer circumference of the elastic layer (2). The elastic layer (2) is formed using an elastic layer coating material containing a liquid-absorbing agent, and the surface layer (3) is formed using a surface layer coating material. The conductive roller manufacturing method involves an elastic layer forming step (A) in which the elastic layer coating material containing a liquid-absorbing agent is applied to the outer circumference of the shaft, and a surface layer forming step (B) in which, after the elastic layer forming step (A), the surface layer coating material is applied on top of the formed elastic layer, and is dried to form the surface layer.

Inventors:
TAGAWA HIROTAKA (JP)
TAKANO JUNICHI (JP)
YOSHIMURA IZUMI (JP)
SIRAKURA DAIJIROU (JP)
Application Number:
PCT/JP2010/072571
Publication Date:
June 23, 2011
Filing Date:
December 15, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
BRIDGESTONE CORP (JP)
TAGAWA HIROTAKA (JP)
TAKANO JUNICHI (JP)
YOSHIMURA IZUMI (JP)
SIRAKURA DAIJIROU (JP)
International Classes:
G03G15/08; G03G15/00; G03G15/02; G03G15/16; G03G21/10
Foreign References:
JP2003098818A2003-04-04
JP2006176550A2006-07-06
JP2005257921A2005-09-22
JP2000213529A2000-08-02
JPH10159834A1998-06-16
JPH09297454A1997-11-18
JPH07199645A1995-08-04
JPH11316487A1999-11-16
JP2004335316A2004-11-25
Other References:
See also references of EP 2515180A4
Attorney, Agent or Firm:
HONDA ICHIRO (JP)
Ichiro Honda (JP)
Download PDF: