CONDUCTIVE RUBBER COMPONENT AND METHOD FOR MOUNTING SAME

Title:

CONDUCTIVE RUBBER COMPONENT AND METHOD FOR MOUNTING SAME

Document Type and Number:

WIPO Patent Application WO/2012/026165

Kind Code:

A1

Abstract:

This conductive rubber component (10) is capable of surface mounting and soldering on, and has a metal film (2) formed by means of atomic and/or molecular deposition on at least one surface in the direction of compression of a conductive rubber unit (1). The method for mounting the conductive rubber component (10) surface mounts the conductive rubber component (10) onto a wiring layer (8) on a printed circuit board (9), and affixes the conductive rubber component by means of a solder layer (7), incorporating the conductive rubber component in order for there to be electrical conduction between the printed circuit board (9) and an electronic component (11). As a result, provided are: a conductive rubber component that is used as an electric contact compatible with surface mount technology (SMT) of electronic components, does not damage the electrode surface of the electronic component even if the body of these electronic apparatuses warps or bends, has low resistance, superior chemical stability, and can be used with SMT; and a method for mounting the conductive rubber component.

Inventors:

OGAWA TOSHIKI
KOIZUMI MASAKAZU

Application Number:

PCT/JP2011/061425

Publication Date:

March 01, 2012

Filing Date:

May 18, 2011

Export Citation:

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Assignee:

FUJI POLYMER IND (JP)
OGAWA TOSHIKI
KOIZUMI MASAKAZU

International Classes:

H01R11/01

Foreign References:

JPS6182609A	1986-04-26
JP4472783B2	2010-06-02
JP2005116406A	2005-04-28
JP4231899B2	2009-03-04
JP4472783B2	2010-06-02

Other References: