Title:
CONDUCTIVE SUBSTRATE, CONDUCTIVE SUBSTRATE LAMINATE, METHOD FOR PRODUCING CONDUCTIVE SUBSTRATE, AND METHOD FOR PRODUCING CONDUCTIVE SUBSTRATE LAMINATE
Document Type and Number:
WIPO Patent Application WO/2015/115528
Kind Code:
A1
Abstract:
[Solution] Provided is a conductive substrate which comprises: a transparent base; a metal layer that is formed on at least one surface of the transparent base; and a blackening layer that is formed on the metal layer by a wet method.
Inventors:
HATA HIROKI (JP)
SHIGA DAIKI (JP)
SUDA TAKAHIRO (JP)
NISHIYAMA YOSHIHIDE (JP)
SHIGA DAIKI (JP)
SUDA TAKAHIRO (JP)
NISHIYAMA YOSHIHIDE (JP)
Application Number:
PCT/JP2015/052474
Publication Date:
August 06, 2015
Filing Date:
January 29, 2015
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
G06F3/044; B32B15/04; G06F3/041; H01B5/14; H01B13/00
Domestic Patent References:
| WO2014010620A1 | 2014-01-16 |
Foreign References:
| JP2012094115A | 2012-05-17 | |||
| JP2003151358A | 2003-05-23 | |||
| JP2011018194A | 2011-01-27 | |||
| JP2013069261A | 2013-04-18 |
Other References:
See also references of EP 3101517A4
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
Tadashige Ito (JP)
Tadashige Ito (JP)
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