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Title:
CONDUCTIVE SUBSTRATE AND CONDUCTIVE SUBSTRATE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/022539
Kind Code:
A1
Abstract:
A conductive substrate is provided which comprises an insulating substrate, a metal layer formed on at least one surface of the insulating substrate, an organic layer formed on the metal layer and containing nitrogen-based organic material, and a blackened layer formed on the organic layer, wherein the contact angle of pure water on the surface of the organic layer opposite to the blackened layer is less than or equal to 60°.

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Inventors:
SUDA TAKAHIRO (JP)
Application Number:
PCT/JP2016/071680
Publication Date:
February 09, 2017
Filing Date:
July 25, 2016
Export Citation:
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Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
G06F3/041; B32B15/08; G06F3/044
Foreign References:
JP2013228986A2013-11-07
JP2014219963A2014-11-20
JP2015120254A2015-07-02
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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