Title:
CONDUCTIVE SUBSTRATE, AND METHOD FOR MANUFACTURING CONDUCTIVE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2016/117512
Kind Code:
A1
Abstract:
The present invention provides a conductive substrate provided with a transparent substrate, a copper layer formed on at least one surface side of the transparent substrate, and a blackening layer formed on at least one surface side of the transparent substrate and containing oxygen, copper, nickel, and molybdenum, the oxygen being contained by 5-60 atom% inclusive.
Inventors:
TAKATSUKA YUJI (JP)
TOGASHI RYO (JP)
YAMAGISHI KOICHI (JP)
SATO ERIKO (JP)
TOGASHI RYO (JP)
YAMAGISHI KOICHI (JP)
SATO ERIKO (JP)
Application Number:
PCT/JP2016/051315
Publication Date:
July 28, 2016
Filing Date:
January 18, 2016
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
G06F3/041; B32B15/08; G06F3/044; H01B5/14
Domestic Patent References:
| WO2014035207A1 | 2014-03-06 | |||
| WO2014203418A1 | 2014-12-24 |
Foreign References:
| JP2008311565A | 2008-12-25 | |||
| JP2013206315A | 2013-10-07 | |||
| JP2013169712A | 2013-09-02 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
Tadashige Ito (JP)
Tadashige Ito (JP)
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