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Title:
CONDUCTIVE SUBSTRATE, METHOD FOR PRODUCING SAME, AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2011/070801
Kind Code:
A1
Abstract:
Disclosed are: a conductive substrate produced by reviewed production processes, wherein the positional accuracy of a transparent conductive film pattern shape and a metal wiring pattern is high even when the pattern shape of the transparent conductive film in the conductive substrate is not highly visible; a method for producing the conductive substrate; and a touch panel. Specifically disclosed is a conductive substrate (4) which comprises, on at least one surface of a transparent substrate (1), a conductive layer (2) and a transparent conductive film (3) in this order from the transparent substrate (1) side. Also specifically disclosed is a method for producing the conductive substrate (4), which comprises a step of forming the conductive layer (2) on at least one surface of the transparent substrate (1) and a step of forming the transparent conductive film (3) on the surface of the conductive layer (2), in this order.

Inventors:
KOBAYASHI Hiroshi (5-1, Taito 1-chome, Taito-k, Tokyo 16, 〒1100016, JP)
小林 裕 (〒16 東京都台東区台東1丁目5番1号 凸版印刷株式会社内 Tokyo, 〒1100016, JP)
Application Number:
JP2010/053917
Publication Date:
June 16, 2011
Filing Date:
March 09, 2010
Export Citation:
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Assignee:
TOPPAN PRINTING CO., LTD. (5-1 Taito 1-chome, Taito-ku Tokyo, 16, 〒1100016, JP)
凸版印刷株式会社 (〒16 東京都台東区台東一丁目5番1号 Tokyo, 〒1100016, JP)
KOBAYASHI Hiroshi (5-1, Taito 1-chome, Taito-k, Tokyo 16, 〒1100016, JP)
International Classes:
H01B5/14; H01B13/00
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