Title:
CONDUCTIVE SUBSTRATE AND METHOD FOR PRODUCING CONDUCTIVE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/183489
Kind Code:
A1
Abstract:
Provided is a conductive substrate which comprises a transparent base and metal wiring lines that are formed on at least one surface of the transparent base, and wherein: each metal wiring line has a structure in which a copper wiring layer and a blackened wiring layer containing nickel and copper are laminated; and the transparent base exposed between the metal wiring lines has a visible light transmittance of 90% or more and a b* value of 1.0 or less.
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Inventors:
SHIMOJI TAKUMI (JP)
Application Number:
PCT/JP2017/014575
Publication Date:
October 26, 2017
Filing Date:
April 07, 2017
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
B32B15/04; G06F3/041; B32B15/20; G06F3/044; H01B5/14; H01B13/00
Domestic Patent References:
| WO2016031802A1 | 2016-03-03 | |||
| WO2016002679A1 | 2016-01-07 |
Foreign References:
| JP2014016944A | 2014-01-30 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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