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Title:
CONDUCTIVE SUBSTRATE AND PROCESS FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2011/065271
Kind Code:
A1
Abstract:
Provided are a conductive substrate which can be produced from inexpensive materials at a lower temperature than conventional substrates, and a process for producing the conductive substrate. The conductive substrate comprises a base (1) and a conductive pattern (5) provided on the base (1), wherein the conductive pattern (5), except for the surface on the reverse side from the base (1) and for the vicinity thereof, wholly has a structure comprising a binder (2) and fine aluminum particles (3) dispersed therein, and the conductive pattern (5) has, formed in the surface and the vicinity, a surface aluminum-metal layer (4) in which fine aluminum particles (3) have been rolled to form conductive connections among the fine particles.

Inventors:
YOSHIDA Manabu (Higashi 1-chomeTsukuba-shi Ibaraki, 65, 〒3058565, JP)
吉田 学 (〒65 茨城県つくば市東1-1-1 中央第5 独立行政法人産業技術総合研究所内 Ibaraki, 〒3058565, JP)
Application Number:
JP2010/070533
Publication Date:
June 03, 2011
Filing Date:
November 18, 2010
Export Citation:
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Assignee:
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (3-1Kasumigaseki 1-chome, Chiyoda-ku Tokyo, 21, 〒1008921, JP)
独立行政法人産業技術総合研究所 (〒21 東京都千代田区霞が関1丁目3番1号 Tokyo, 〒1008921, JP)
YOSHIDA Manabu (Higashi 1-chomeTsukuba-shi Ibaraki, 65, 〒3058565, JP)
International Classes:
H05K3/12; H01B5/14; H01B13/00; H05K1/09
Attorney, Agent or Firm:
OIKAWA Yasuyoshi (32-5Matuba-cho 7-chom, Kashiwa-shi Chiba 27, 〒2770827, JP)
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