Title:
CONDUCTIVE SUBSTRATE FOR TOUCH PANEL, AND METHOD OF MANUFACTURING CONDUCTIVE SUBSTRATE FOR TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2016/017773
Kind Code:
A1
Abstract:
[Problem] To provide a conductive substrate for touch panels, said substrate including: an insulating base material; a base metal layer disposed on at least one face of the insulating substrate and including nickel; a copper thin film layer disposed on the base metal layer; and a copper plating film disposed on the copper thin film layer and having one face that faces the copper thin film layer and another face positioned on the reverse side from said one face, wherein the concentration of sulfur in a region from the surface of the other face of the copper plating film to a depth of 0.3 μm is 10-150 mass ppm, and the surface roughness (Ra) of the other face of the copper plating film is 0.01-0.15 μm.
Inventors:
NAGATA JUNICHI (JP)
Application Number:
PCT/JP2015/071690
Publication Date:
February 04, 2016
Filing Date:
July 30, 2015
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
B32B7/02; G06F3/041; B32B15/08; B32B15/20; G06F3/044; H01B5/14; H01B13/00
Domestic Patent References:
| WO2007039992A1 | 2007-04-12 | |||
| WO2008126522A1 | 2008-10-23 |
Foreign References:
| JP2014082320A | 2014-05-08 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
Tadashige Ito (JP)
Tadashige Ito (JP)
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