Title:
CONDUCTIVE SUBSTRATE AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2023/228927
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a conductive substrate in which the sulfuration resistance of a conductive fine wire section is excellent, as well as a touch panel having said conductive substrate. A conductive substrate according to the present invention has a base material and a conductive layer that is positioned on the base material, wherein the conductive layer has a conductive fine wire section that includes metal, and a transparent insulating section that is adjacent to the conductive fine wire section and does not include metal, and the conductive layer includes a compound that is represented by formula (1), formula (2), formula (3), or formula (4).
Inventors:
TANAKA SATOSHI (JP)
NAKAYAMA AYA (JP)
NAKAGAWA YUKI (JP)
NAKAYAMA AYA (JP)
NAKAGAWA YUKI (JP)
Application Number:
PCT/JP2023/019062
Publication Date:
November 30, 2023
Filing Date:
May 23, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01B5/14; B32B7/025; G06F3/041; G06F3/044
Foreign References:
JP2015022397A | 2015-02-02 | |||
JP2009188360A | 2009-08-20 | |||
JP2014141592A | 2014-08-07 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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